Processor
Qualcomm® QCS6490 SoC
- 1 × Kryo Prime @ 2.7 GHz + 3 × Kryo Gold @ 2.4 GHz + 4 × Kryo Silver @ 1.9
GHz
- GPU: Qualcomm® Adreno 643 (OpenGL® ES 3.2/2.0/1.1, Vulkan® 1.1/1.2/1.3, OpenCL™ 2.2, DirectX Feature Level 12)
DSP and AI Engine
- Compute Hexagon DSP with dual Hexagon Vector eXtensions (HVX)
- Additional Hexagon coprocessor 2.0 that complements the main CPU and DSP
- Hexagon Tensor Accelerator
RAM
LPDDR5 RAM 5500MT/s
4GB /6GB /8GB /12GB /16GB
Onboard eMMC 5.1/UFS 3.0 2-lane module connector for high-performance embedded storage
- optional eMMC storage modules 16GB, 32GB and 64GB
- optional UFS storage modules 128GB, 256GB and 512GB
Onboard SPI Flash for Bootloader
VPU: Adreno video processing unit 633
Interfaces
Display
1× HDMI® Output Interface, supporting up to 4Kp30 resolution
1x MIPI DSI Interface (four lane MIPI DSI)
Camera
1x four lane MIPI CSI and 2x dual lane MIPI CSI Interface
Wireless
IEEE 802.11 a/b/g/n/ac/ax (WiFi 6) and Bluetooth 5.4 with BLE (2x external Antenna Conn)
Storage
1x Micro SD card slot
1x M.2 M Key Connector with PCIe® Gen3 (2‑lane) for M.2 2230 NVMe SSD
1x eMMC & UFS Module Combo Connector
USB
1x USB 3.1 Type A HOST Port
3x USB 2.0 Type A HOST Port
1x USB 2.0 OTG Type C® Port for Data and Power
Ethernet
1x Gbit LAN Port with (1x PoE support via optional PoE hat)
GPIO
40-pin expansion header supporting:
Other
Software
・Supports Radxa OS, Ubuntu Linux, Deepin Linux, Armbian, Arch Linux, Qualcomm®
Linux (Yocto based), and Windows on Arm
・ Hardware access/control library for Linux and Android platforms
Power
USB Type‑C PD power supply with 12V capable, (min. 18W, with USB and PCIe peripherals >24W)
Size
56mm x 85mm
Operation temperature:
0°C to 60°C
Certifications:
FCC, CE, RoHS
Availability:
until at least September 2035
!