SOC
Qualcomm® Snapdragon 8cx Gen 3 Compute Platform
- 4 × Kryo Prime @ 3.0 GHz + 4 × Kryo Gold @ 2.4GHz, 64-bit CPU Architecture, 5nm process technology
- GPU: Qualcomm® Adreno 690 (support DirectX Feature Level 12, DirectML)
NPU
- Qualcomm® Hexagon®
AI Engine
- Qualcomm® AI Engine with Up to 29+ TOPS
DSP / Sensing
- Qualcomm® Hexagon® Processor
- Qualcomm® Sensing Hub
Process Technology
5 nm
RAM
LPDDR4X RAM 4266MT/s
up to 32GB
Memory bus width: 128-bit (8 channel, 16-bit per channel)
Onboard SPI Flash for bootloader
STORAGE
Onboard SPI Flash for Bootloader
VPU: Qualcomm® Adreno® VPU (5th-generation UHD video processing unit)
Interfaces
Display
1× HDMI® 2.1 FRL (Standard Type-A), up to 4K@120
2x USB Type-C (USB 3.1, DisplayPort 1.4 Alt Mode), up to 4K@120
1x MIPI DSI Interface (four lane MIPI DSI)
Camera
1x four lane MIPI CSI and 2x dual lane MIPI CSI Interface
Wireless
1x M.2 E Key 2230 Slot for WiFi / Bluetooth
Supports the latest WiFi 7 Wireless Module (Only V1.3 and later versions support WiFi7)
USB
2x USB 3.2 Gen 2 Type-C Port (DisplayPort 1.4 Alt Mode)
2x USB 3.2 Gen 2 Type A Port
2x USB 2.0 Type A Port
1x USB Type C Port for Power
Ethernet
2x 2.5 GbE RJ45 Port
Audio
1x 3.5mm Headphone Jack
1x Mic Input Connector
40-pin expansion header supporting:
Other
Software
・Supports Radxa OS, Windows, Ubuntu Linux, Armbian, Arch Linux, Nix OS
・Supports standard UEFI boot with built-in default Device Tree and direct boot from unified ARM IOS images
・Includes hardware access libraries for Linux platforms
Power
1x USB Type‑C Port for Power with PD protocol, max input voltage is 20V (recommended 60W (20V/3A) USB-C PD adapter for full performance and peripherals
1x Power Input Header (VIN/GND/PWR)
12-20V power input
Support for external power button
Size
100.2mm x 74.2mm
Operation temperature:
0°C to 60°C
Certifications:
FCC, CE, RoHS in progress
Availability:
expected until at least June 2029 (pls note: certain component shortages or EOL announcements from third‑party suppliers may affect lead times)
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